It has often been said that necessity is the mother of invention, and nowhere is that truer than at Aguila Technologies. We are so committed to our customers' success that if current technology doesn't meet their needs then we will invent a new process or technology that does! As a result, Aguila Technologies has become a leading innovator in flip chip bonding, wafer level packaging, and conductive adhesives and a variety of other microelectronic fabrication innovations.

Aguila Technologies has developed an extensive portfolio of patented intellectual property related to the fabrication of flip chips and flip chip assemblies. We are always looking for faster, less-costly, more reliable processes and materials. Oftentimes, this means that we must invent them ourselves! Our research and development program has experienced unprecedented success in this area, generating patents in wafer-level packaging, no-flow underfill, pre-applied underfills, reworkable underfills and laser flip chip fabrication, as well as intellectual property related to conductive adhesives, paints, and inks.