TLPS adhesives

TLPS materials form metallurgical bonds during the cure process that provide very high effective thermal conductivity in the bondline, much closer to solder materials than silver-filled epoxies. Current formulations demonstrate bulk thermal conductivity up to 50 W/m-K, effective conductivity up to 40 W/m-K, and die-shear strengths to metalized surfaces of up to 4000 psi.  Adhesion retention remains stable after high temperature and high humidity storage, as well as after thermal cycling. The polymer matrix acts as both an adhesive binder for the filler particles and as a flux to remove oxides from the surfaces of the metal powders, allowing the powders to liquid-phase sinter during cure. To improve processability, Aguila has developed novel patented polymer flux formulations which rely on a different crosslinking reaction than previous polymer flux chemistries, allowing for sufficient pot-life while still providing high oxide-removing capability. The new materials allow for direct die-attach of high-power semiconductors to their thermally enhanced packages, eliminating the need for heat-spreading shims as well as multiple processing steps. Aguila has developed lead-containing and lead-free formulations to serve both military and commercial markets, respectively.

The new die-attach materials are fully compatible with conventional dispensing equipment as well as with screen printing. The formulations show no particular degradation in adhesion when subjected to JEDEC Level 1 moisture resistance testing. Preliminary MIL-STD 883 testing and qualification is also underway.

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