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We can create customized materials for your electronics packaging needs. Our areas of expertise include conductive adhesives and coatings , wafer applied underfills, and low-temperature polymer fluxes. |
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We can create customized solutions specifically targeted to meet your design needs. Our unique engineering and fabrication teams can create high density electronics and packaging (flip-chip, chip scale, and BGA) solutions that will exceed your expectations. |
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Electronics Packaging Design & Manufacturing |
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We can create customized solutions specifically targeted to meet your design needs. Our unique engineering and fabrication teams can create high density electronics and packaging (flip-chip, chip scale, and BGA) solutions that will exceed your expectations. |
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Radiation Detector Manufacturing |
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As a leading manufacturer of state-of-the-art flip-chip products, we can apply our years of experience to solving your sensor packaging challenges. Our novel technologies in design, fabrication and low-cost production of sensor products have emerged from our core know-how in high-density electronics. |
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