We can create customized solutions specifically targeted to meet your design needs. Our unique engineering and fabrication teams can create high density electronics and packaging (flip-chip, chip scale, and BGA) solutions that will exceed your expectations.

Laser Micromachining

• In the world of high-density microelectronics packaging, precision is everything. This is why Aguila Technologies has invested in ultra precision ND:YAG laser machining. Let us put the power of this cutting-edge tool in your hands. Use it to precisely cut and shape plastics, laminates, composites, metals, ceramics, glasses, semiconductors, or even copper.

Capabilities

• When precision counts, trust your laser machining work to the best team in the business, Aguila Technologies. The combination of our highly skilled technicians and advanced ESI 5150 Laser Processing System can create very clean microstructures with sharply defined edges, steep walls and unprecedented precision, in just about any material. Take a look at a few of our capabilities and then give us a call to see what we can do for you.
  Drill microvias (diameter as small as 25 µm) in polyimide, stainless steel, silicon wafers, sapphire, Nitinol, phenolic, and most any material.
• Laser structure microscopic grooves, steps, channels or cavities into parts by skiving away material using our computer-controlled focused laser microbeam.
• Scribe numbers, emblems, alignment features, or logos on most any part with micron precision.
• Create precision polymeric or metallic stencils and masks.
• Micro rework and repair rigid and flex printed circuits.
• Drill precision alignment holes or precisely cut edges on molded plastic parts.
• Trim, drill and dice MEMS devices.
• Create precise solder-mask-defined solder pads on printed circuits and other components by selective removal of solder mask
• Drill a precision hole for aligning an optical fiber
• We can accommodate parts up to 21" x 25" that are up to 0.75" thick. Send us your drawings and/or specifications via AutoCAD (.dxf or .dwg), Gerber (.gbr) files, or printouts and we can modify them for use on the laser's system.

Services Offered

• Laser cutting, laser drilling, laser marking
• Evaluation of product or process feasibility
• Consultation in laser material processing
• Development & optimization of production processes
• Large-volume purchase agreements
• Pilot and short-run production
• Test samples and prototypes
• File translation for CAM
• Produce laser stencils
• CAD

Laser Micromachining

• Our ESI 5150 Laser Processing System is a high speed, high throughput ND:YAG laser cutting and marking system with the following features:
• 355 nm output tripled ND:YAG laser
• Beam diameter ~ 20 microns (nominally 1 mil)
• X-Y vacuum chuck stage with 21" x 25" capacity
• Galvanometer beam positioning with "cut on the fly"
• CAD-CAM controlled
• Single or multiple part lay-ups
• Temperature controlled environment

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