We can create customized solutions specifically targeted to meet your design needs. Our unique engineering and fabrication teams can create high density electronics and packaging (flip-chip, chip scale, and BGA) solutions that will exceed your expectations.

Here are just a few examples of Aguila Technologies' chip packaging capabilities. Give us call and let us custom design a solution for your next product.
Rapid prototyping of area array, ball grid array (BGA), micro-BGA, and CSP packaging.

• Solder bumping and low-temperature solder bumping and bonding.
• Flip chip-in-package and chip on board (COB) assemblies.
• Integrated circuit system in package (SiP), and multichip modules (MCM).
• Hi-density sensor array assemblies.
• High density interconnects (HDI) and high density microelectronics packages.
• No-flow underfills are our specialty
• Pre-applied underfills, and wafer-level underfills (WUF)

Packaging Services Offered

• Custom microelectronics packaging design engineering and development
• Packaging design, fabrication and assembly
• Wafer-level packaging and redistribution
• Microelectronic device development, design and rapid prototyping
• Wafer bumping and dicing
• Rapid prototyping
• Die attach and wirebonding
• MEMs device packaging
• Indium bump bonding substitutions
• Custom laminations
• Wafer sawing
• Plasma cleaning
• BGA reballing and solder bumping

Facilities and Equipment

• Aguila Technologies features state-of-the-art technology, equipment and facilities Class 100 temperature & humidity-controlled clean room
• Fully-equipped polymer & materials laboratories
• Fully-automated, electrically-live thermal and humidity stress testing
• Plasma chamber
• Lamination press
• Ultrafine pitch pick & place equipment
• Multizone convection reflow oven
• High-power microscopy and cross-sectioning equipment

For more information please contact us at This e-mail address is being protected from spam bots, you need JavaScript enabled to view it