Fabrication of complex gamma sensors poses many challenges. Designing the right package becomes critical to ensuring optimal performance of your sensor. At Aguila Technologies, we are focused on creating custom gamma sensors that can meet your special needs. As a leading manufacturer of state-of-the-art flip-chip products, we have applied our years of experience to solving your sensor packaging challenges. Our novel technologies in design, fabrication and low-cost production of sensor products have emerged from our core know-how in high-density electronics.

For example, we have brought our experience in packaging to the fabrication of practical CZT detector array modules. The result is a new detector packaging technology that is revolutionizing the emerging CZT detector field. Aguila’s patent-pending sensor technology comprises a flip-chip CZT sensor bump-soldered onto a high-density printed circuit or ASIC using chip-stacking technology. This low-profile package can be designed into planar arrays of unlimited size. If we can accomplish something as revolutionary as this, just think what Aguila Technologies can do for you. Let our experts design and fabricate a custom sensor package for you. We'll help you get it right the first time!

Aguila Technologies produces custom high-density sensors for applications in portable sensing, medical imaging, astrophysics, and remote wireless monitoring.

Cadmium Zinc Telluride

Cadmium Zinc Telluride (CZT) has long been known to possess the stopping power, room temperature sensitivity and spectral resolution required for hard X-ray and gamma-ray detection, but fabrication issues had prevented its use as a viable detector in many applications in nuclear medicine, astrophysics, homeland security and industrial x-ray imaging.

This is no longer a problem, however, thanks to Aguila Technologies' research and development. We brought our experience in packaging to the fabrication of practical CZT detector array modules. The result is an incredible new detector packaging system that is revolutionizing the emerging CZT detector industry.

Aguila's patent-pending flip-chip technology comprises a flip-chip CZT sensor soldered onto a high-density printed circuit or ASIC using chip stacking technology. This low profile module can be designed to have zero dead space around it so it can be 'tiled' into planar arrays of unlimited size.

What makes this packaging technology possible is the development of a reliable low-temperature soldering process that combines solder-bump bonding and underfill encapsulation in one operation. Our CZT detector technology can easily be adapted to any number of applications, including mammography, PET and SPECT imaging systems, astrophysical X-ray detection, and high-resolution nuclear spectrometers for homeland defense systems.