A solder-bumped flip chip with a pre-coated underfill. For improved reliability, the underfill can include a mixture of a polymer and an inorganic filler. The underfill can also contain at least one meltable portion, which provides for easy rework. When used with an adhesive having fluxing properties, this unique invention allows simultaneous flip chip soldering and underfill curing in a reworkable structure.
