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Details for US Patent 6,399,426
| Property | Value |
| Name | US Patent 6,399,426 |
| Description | A method for making an underfilled flip chip assembly using a pre-applied underfill. - An encapsulant is applied to a solder-bumped flip chip while exposing the tips of the solder bumps.
- A polymer with fluxing properties is then applied either to the encapsulated chip or to a printed circuit.
- The encapsulated chip is placed on the printed circuit.
- The combination is heated to melt the solder bumps and simultaneously harden the polymer.
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| Filename | 06399426.pdf |
| Filesize | 1.44 MB |
| Filetype | pdf (Mime Type: application/pdf) |
| Creator | admin |
| Viewers | Everybody |
| Maintained by | Editor |
| Hits | 283 Hits |
| Last updated on |
12/13/2007 23:27 |
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